11 December 2024 | News
MoU outlines cooperation in key focus sectors including IT, Artificial Intelligence, electronics and Global Capability Centers
The US Chamber of Commerce’ s US India Business Council Global Private Limited (USIBC GPL) and the Department of Information Technology, Electronics & Communications (IT E&C), Government of Telangana, have signed a Memorandum of Understanding (MoU) to bolster US-India collaboration and partnership in technological innovation.
The MoU was signed in the presence of Chief Guest, Minister for Information Technology (IT), Electronics & Communications (E&C), Industries & Commerce (I&C), and Legislative Affairs, D Sridhar Babu and Special Chief Secretary to the Government of Telangana for IT E&C and I&C; Jayesh Ranjan, Guest of Honour, Jennifer Larson, US Consul General Hyderabad, and USIBC Managing Director Rahul Sharma.
The MoU outlines cooperation in key focus sectors including IT, Artificial Intelligence (AI), electronics and Global Capability Centers (GCCs). The signing was followed by an industry roundtable on AI and GCCs, reinforcing Hyderabad and Telangana’s role as a global technology hub.
The discussion highlighted Hyderabad’s thriving ecosystem of skilled professionals and its pivotal role in US-India collaborations. The participants explored AI-driven opportunities across sectors as well as the ways to optimally harness AI technological innovation for global good while at the same time prevent misuse via regulation, governance, ethical use, in a manner that does not stifle innovation.